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Multi-Layer

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Three or more conductive material layers (typically copper) separated by a dielectric film insulator - with or without adhesive bonding - interconnected with plated through holes, and insulated with an adhesive-bonded dielectric film on at least one side.

• Multi-Layer Circuits allow for high density packaging using complex point -to-point wiring. They can integrate systems requiring multiple interconnections into one unit reducing assembly time, cutting weight and volume, and increasing reliability.
• Multi-Layer Circuits generally consist of multiple single or double sided circuits laminated together to form an integral component. They can be fully bonded or bonded only in selective regions to allow increased flexibility.
• Multi-Layer Circuits are capable of total programmability for all electrical characteristics.

• Pattern or selective (Button) plating is available
• Epoxy/Glass rigid stiffeners may be applied to one or two sides to stabilize surface mount components.
• A variety of finishes are available for RoHS compliance.
• Circuits can be laminated to reinforced material (Epoxy/glass rigid laminate), providing a "palletized" platform to facilitate automatic component assembly.

• High pin-count jumper
• Replacement for discreet wire bundle harness
• Component interconnect
• High speed (impedance) applications
• Complex communication equipment
• Avionics
• Guidance and controls
• Power generation and distribution systems

Finding the right stack-up solution for your design can help reduce costs and improve manufacturability. Download a PDF of the Multi-Layer (Type 3) Stack-up.

Qualifications

• ISO-9001:2008
• AS-9100
• MIL-P-50884
• IPC-6013
• ITAR
• JCP

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