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Rigid-Flex

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Three or more conductive material layers (typically copper) separated internally by a dielectric film insulator - with or without adhesive bonding, and externally by a glass reinforced (glass woven) resin, and interconnected with plated through holes.

• Rigid-Flex Circuits consist of multiple single or double sided circuits with a cap layer of rigid core bonded to the top and bottom sides to further add stability to the bonded areas.
• Rigid-Flex Circuits can provide for both surface and through hole components mounted in rigidized areas without risking damage from flexing.
• Rigid-Flex Circuits are able to replace a number of rigid boards connected with wire harnesses and eliminate the need for costly or long lead hardware.
• Rigid-Flex Circuits are capable of total programmability for all electrical characteristics.

• Staggered layers with progressive lamination and plating.
• Conductive Silver Epoxy may provide shielding on one or two sides of inner layers in non bonded area(s).
• A variety of finishes are available for RoHS compliance.

• High pin-count jumper
• Replacement for multiple discreet wire bundle harnesses
• Dense component interconnect (SMT, BGA, QFP)
• High speed (impedance) applications
• Backplanes and motherboards
• Complex communication equipment; video/color avionics
• Advanced guidance and controls
• Single-board computers
• RF and signal generation systems

Finding the right stack-up solution for your design can help reduce costs and improve manufacturability. Download a PDF of the Rigid-Flex (Type 4) Stack-up.

Qualifications

• ISO-9001:2008
• AS-9100
• MIL-P-50884
• IPC-6013
• ITAR
• JCP

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